In 2012, the International Electrotechnical Commission (IEC) launched a committee to develop standards for the emerging area of printed electronics. The TC119 committee is due to publish the first of its final standards by the end of 2016.
Alan Hodgson, technical development manager at 3M, is chair of the committee for TC 119. He provides an update on the standards development for +Plastic Electronics.
The work of TC 119 is progressing well and the committee is starting to establish some formal structure. TC 119 now has four working groups (WG), with three other groups that could yet achieve that status. These groups are now active and conducting meetings separate to the plenary sessions. As an example, WG3 (Equipment) and WG4 (Printability) have arranged a meeting together at a common location in Tokyo.
Work groups
WG2 (Materials) is currently working in two major areas. The first is standards for printed electronics substrates, with the focus currently being on glass and polymer media. I would urge readers with interest in other substrates to look into this work and consider involvement.
WG2 (Materials) is currently working in two major areas. The first is standards for printed electronics substrates, with the focus currently being on glass and polymer media. I would urge readers with interest in other substrates to look into this work and consider involvement.
WG3 (Equipment) is setting standards for both contact and non-contact fabrication. Current work includes dimensions of printing plates and the patterns thereon, and performance metrics for inkjet heads in printed electronics applications.
Involvement in international standards activity is organised by country. TC 119 currently has 12 nations actively participating, with one more currently seeking association. There are also seven nations observing this work. Two of these have significant printed electronics programmes, so it is hoped that they will soon apply for participation member status.
Next meeting
The next full meeting of TC 119 will take place in Cambridge, UK. It will cover three full days, on 17-19 March 2014. The meeting will be followed by a one-day conference on 'Manufacturing for Printed Electronics' on 20 March, and visits to local institutions on 21 March. The agenda forms the UK's first Printed Electronics Week.
The next full meeting of TC 119 will take place in Cambridge, UK. It will cover three full days, on 17-19 March 2014. The meeting will be followed by a one-day conference on 'Manufacturing for Printed Electronics' on 20 March, and visits to local institutions on 21 March. The agenda forms the UK's first Printed Electronics Week.
The Manufacturing for Printed Electronics Conference will be an international event covering the recent advances in fabrication techniques and materials for printable electronics. There will be specific focus on making the transition from 'lab to fab' and integrating devices into a final product.
Alan Hodgson, technical development manager at 3M, is chair of the committee for TC 119. Image: 3M
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